AIPK — Defiance AI Packaging & Testing ETF

AIPK Fund Overview

AIPK — Defiance AI Packaging & Testing ETF is a US ETF managed by ETF Series Solutions, categorised as Growth Thematic Equity. ABC INVEST provides holdings, performance, costs, cashflows, risk data, prospectus documents and SEC filings, sourced from SEC filings.

• Type: US ETF
• Manager: ETF Series Solutions
• Category: Growth Thematic Equity
• Ticker: AIPK
• SEC CIK: 0001540305
• SEC series ID: S000107091
• Share class ID: C000277978

AIPK Investment Objective and Strategy

Defiance AI Packaging & Testing ETF describes its objective and strategy as follows, from its latest prospectus filed with the SEC by ETF Series Solutions.

Investment objective

The Defiance AI Packaging & Testing ETF (the “Fund” or the “AI Packaging & Testing ETF”) seeks to track the total return performance, before fees and expenses, of the BITA AI Advanced Packaging and Testing Index (the “Index”).

Principal investment strategy

The Fund uses a “passive management” (or indexing) approach to track the total return performance, before fees and expenses, of the Index. BITA AI Advanced Packaging and Testing Index The Index seeks to track the performance of publicly traded companies with material involvement in the provision of specialized packaging and testing for artificial intelligence (“AI”) semiconductors. The Index captures both suppliers of critical materials, substrates, equipment, and test systems, as well as outsourced semiconductor assembly and test (“OSATs”), foundries, and integrated database management system (“IDMs”) that offer advanced packaging services. Eligible constituents must demonstrate significant thematic exposure to the Index’s theme based on its total revenue derived from, or through its material involvement in, the following segments: Process Control & Metrology : Companies that provide inspection, measurement, and defect-detection systems for semiconductor wafers and packages.

They use optical, electron-beam, and X-ray techniques to verify critical dimensions, film thickness, overlay accuracy, and surface quality at nanometre scales, enabling high yields in advanced packaging production lines. Wafer-Level Back-End Processing : Companies that perform post-front-end processes while chips are still on the silicon wafer, including redistribution layer (RDL) formation, under-bump metallisation (UBM), copper pillar plating, and through-silicon via (TSV) creation. These steps are essential for fan-out, wafer-level chip-scale packaging (WLCSP), and 3D-IC stacking. Die Bonding & Assembly : Companies that develop and operate precision pick-and-place, die attach, and thermocompression bonding equipment used to mount individual semiconductor dies onto substrates, interposers, or other dies.

They enable high-density interconnection in multi-chip modules, chiplet-based designs, and memory stacks. Factory Automation & Wafer Handling : Companies that supply automated material handli

AIPK Costs and Fees

AIPK costs about $65 per $10,000 invested per year in fund expenses.

• Net expense ratio: 0.65%
• Gross expense ratio: 0.65%

AIPK Debt Constituents

No individual debt constituents are reported in Defiance AI Packaging & Testing ETF's latest SEC N-PORT filing.

AIPK Prospectus and SEC Filings

Official Defiance AI Packaging & Testing ETF filings on SEC EDGAR — prospectus, portfolio holdings and annual reports.

• Prospectus (485BPOS) — filed 2026-08-10
• Prospectus supplement (497) — filed 2026-08-13

Related Funds

Other Growth Thematic Equity funds tracked on ABC INVEST:

• 800VDC AI Datacenter Ecosystem ETF (HUMM)
• Amplify Top 10™ Robotics ETF (ROBX)

Data Sources

ABC INVEST compiles this page from public filings made to the U.S. Securities and Exchange Commission (SEC) through EDGAR: portfolio holdings and monthly cashflows from Form N-PORT, expenses and returns from fund prospectuses (Form 485BPOS) and the SEC DERA Risk/Return Summary data sets, annual data from Form N-CEN, and shareholder reports from Form N-CSR.